The Chips JU released two calls aiming at enhancing international cooperation in the field of semiconductor:

- EU-Japan Joint Call on Semiconductors, supporting collaborative research to advance:
The scope is on:
• 2.5D/3D integration and integrated photonics processes,
• chiplet co-optimization and interface design,
• through-silicon vias, interposers and advanced bonding techniques,
while fostering collaboration between material scientists, chemical engineers, semiconductor manufacturers and AI experts to accelerate industrial uptake and contribute to future global semiconductor standards.

- International Call with Digital Partnership & TTC countries, promoting low-TRL research and innovation in chip design and manufacturing with India, Singapore, and Taiwan: Call Details
The call focuses on:
• research up to TRL 4 across design, fabrication, packaging and integration technologies,
• novel materials, physical concepts and device architectures, including neuromorphic and advanced integration technologies,
• innovative approaches with clear projections of expected performance gains and key figures of merit.

Both calls reflect the growing importance of international cooperation to address the technological challenges of next-generation semiconductors and strengthen global innovation ecosystems.