ICOS² will be present at SEMICON Europa, represented by AENEAS at the AENEAS booth within the Chips JU booth. Come and meet some of the project partners, learn more about ICOS²’s objectives, and discover its first results and contributions to strengthening Europe’s semiconductor ecosystem through international cooperation.
Join us at TechARENA, Hall B0, for the session “Chips Act 2.0 - Building Europe’s Trusted Semiconductor Alliances”, exploring how trusted international partnerships can reinforce Europe’s resilience, competitiveness, and technological leadership in the semiconductor sector. Giorgos Fagas, ICOS² coordinator will have the opportunity to present the project and its implication for international cooperation
14:20 - ICOS²: Driving International Cooperation on Semiconductors
Speaker: Giorgos Fagas, Director of Strategic Development, Tyndall National Institute
Abstract:
As Europe considers a potential Chips Act 2.0, trusted international partnerships will be essential to strengthening supply chain resilience, accelerating innovation, and reinforcing Europe’s position in the global semiconductor value chain.This presentation will showcase how ICOS² identifies opportunities for collaboration with key semiconductor ecosystems and provides evidence-based insights and strategic recommendations to support European semiconductor policy. It will also explore practical pathways for international engagement, joint research and innovation, talent exchange, and strategic industrial cooperation.The session will bring together policymakers and industry leaders to discuss Chips Act 2.0, trusted international partnerships, and the development of resilient and competitive semiconductor ecosystems.
On November 12th at 13:30, ICOS² partner Ryoichi Ishihara from Delft University of Technology will take part in the session “Future Standards in Focus: Innovation and Industry Readiness”, with his talk “Future Standards for Emerging Technologies”.
He will also present the ICOS² project, highlighting its contribution to international cooperation and the future of the semiconductor industry.
We look forward to connecting with the semiconductor community at SEMICON Europa and discussing on international cooperation.
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ICOS² is strengthening its international presence through its participation in discussions on semiconductor and quantum technologies at the International Conference on Industrial Technology Innovation (ICITI 2026), held in Taipei, Taiwan.
As part of this international event, ICOS² is pleased to highlight the contribution of its partner, AENEAS Association, through a presentation delivered by Patrick Cogez from AENEAS, entitled “Semiconductor and Quantum R&D Directions under the Quantum Europe Strategy and Chips Act 2.0.” The presentation explored the evolving European policy landscape for semiconductor and quantum technologies, outlining key strategic initiatives, research and development priorities, and opportunities for enhanced international cooperation. As these technologies become increasingly important to industrial competitiveness and technological sovereignty, fostering dialogue between international stakeholders is essential. Collaboration across regions helps accelerate innovation, strengthen industrial ecosystems, and build more resilient semiconductor supply chains.
Through initiatives such as ICOS², international cooperation remains a key driver of progress in semiconductor and quantum technologies.
Launched by the European Commission in 2023, the European Chips Act has created an important framework to strengthen the EU’s semiconductor capabilities, covering from research and design to manufacturing, packaging, and skills.
Building on the foundations of this initial Chips Act, the Chips Act 2.0 was proposed this summer, with the aim of further enhancing the EU’s technological autonomy and industrial competitiveness, and improving supply-chain resilience. The focus is now expanding further, towards advanced semiconductor technologies, market uptake, supply-chain resilience and stronger cooperation across the ecosystem.
One message is clear: international cooperation is essential. Europe’s semiconductor competitiveness requires stronger connections across borders and along the entire value chain.
ICOS² is aligned with the Chips Act and its associated proposal, aiming to turn evidence-based market data, technological trends, cooperation models and disruptive case studies into actionable actions that will support the development of a more resilient, innovative and competitive European semiconductor ecosystem.
Check out the useful overview prepared by our partner AENEAS to dive into the main ideas of the Chips Act 2.0: https://lnkd.in/eTK57rus
The European Commission announcement on the EU-India agreements marks a significant milestone for international cooperation in the semiconductor sector.
These agreements reinforce a shared commitment to:uilding more resilient and trusted semiconductor supply chains; fostering innovation and technology cooperation; facilitating investment and industrial collaboration; creating a more predictable framework for cross-border partnerships.
The negotiations are now launched to associate India to Horizon Europe.
These priorities are closely aligned with the mission of ICOS².
By supporting dialogue between governments, industry, research organisations, and innovation ecosystems, ICOS² contributes to the international partnerships needed to address global semiconductor challenges and seize emerging opportunities.
Find the press release here: https://lnkd.in/dcfjRghD
The Chips JU released two calls aiming at enhancing international cooperation in the field of semiconductor:
- EU-Japan Joint Call on Semiconductors, supporting collaborative research to advance:
The scope is on:
• 2.5D/3D integration and integrated photonics processes,
• chiplet co-optimization and interface design,
• through-silicon vias, interposers and advanced bonding techniques,
while fostering collaboration between material scientists, chemical engineers, semiconductor manufacturers and AI experts to accelerate industrial uptake and contribute to future global semiconductor standards.
- International Call with Digital Partnership & TTC countries, promoting low-TRL research and innovation in chip design and manufacturing with India, Singapore, and Taiwan: Call Details
The call focuses on:
• research up to TRL 4 across design, fabrication, packaging and integration technologies,
• novel materials, physical concepts and device architectures, including neuromorphic and advanced integration technologies,
• innovative approaches with clear projections of expected performance gains and key figures of merit.
Both calls reflect the growing importance of international cooperation to address the technological challenges of next-generation semiconductors and strengthen global innovation ecosystems.