Launched by the European Commission in 2023, the European Chips Act has created an important framework to strengthen the EU’s semiconductor capabilities, covering from research and design to manufacturing, packaging, and skills.
Building on the foundations of this initial Chips Act, the Chips Act 2.0 was proposed this summer, with the aim of further enhancing the EU’s technological autonomy and industrial competitiveness, and improving supply-chain resilience. The focus is now expanding further, towards advanced semiconductor technologies, market uptake, supply-chain resilience and stronger cooperation across the ecosystem.
One message is clear: international cooperation is essential. Europe’s semiconductor competitiveness requires stronger connections across borders and along the entire value chain.
ICOS² is aligned with the Chips Act and its associated proposal, aiming to turn evidence-based market data, technological trends, cooperation models and disruptive case studies into actionable actions that will support the development of a more resilient, innovative and competitive European semiconductor ecosystem.
Check out the useful overview prepared by our partner AENEAS to dive into the main ideas of the Chips Act 2.0: https://lnkd.in/eTK57rus
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@Tyndall National Institute
The European Commission announcement on the EU-India agreements marks a significant milestone for international cooperation in the semiconductor sector.
These agreements reinforce a shared commitment to:uilding more resilient and trusted semiconductor supply chains; fostering innovation and technology cooperation; facilitating investment and industrial collaboration; creating a more predictable framework for cross-border partnerships.
The negotiations are now launched to associate India to Horizon Europe.
These priorities are closely aligned with the mission of ICOS².
By supporting dialogue between governments, industry, research organisations, and innovation ecosystems, ICOS² contributes to the international partnerships needed to address global semiconductor challenges and seize emerging opportunities.
Find the press release here: https://lnkd.in/dcfjRghD
The Chips JU released two calls aiming at enhancing international cooperation in the field of semiconductor:
- EU-Japan Joint Call on Semiconductors, supporting collaborative research to advance:
The scope is on:
• 2.5D/3D integration and integrated photonics processes,
• chiplet co-optimization and interface design,
• through-silicon vias, interposers and advanced bonding techniques,
while fostering collaboration between material scientists, chemical engineers, semiconductor manufacturers and AI experts to accelerate industrial uptake and contribute to future global semiconductor standards.
- International Call with Digital Partnership & TTC countries, promoting low-TRL research and innovation in chip design and manufacturing with India, Singapore, and Taiwan: Call Details
The call focuses on:
• research up to TRL 4 across design, fabrication, packaging and integration technologies,
• novel materials, physical concepts and device architectures, including neuromorphic and advanced integration technologies,
• innovative approaches with clear projections of expected performance gains and key figures of merit.
Both calls reflect the growing importance of international cooperation to address the technological challenges of next-generation semiconductors and strengthen global innovation ecosystems.